This method is cheap, high precision (± 0.1mm) directly instead of wood molding sand. Rapid manufacturing of metal parts, the key to the sintering of metal powder oxidation and thermal conductivity of a metal powder coated with adhesive, using selective laser irradiation, the adhesive hot melt adhesive forming part removed from the powder Beyond the cracks in the perfusion metal finally made parts. Another new study method is directly with non-coated metal powder sintering manufacturing parts, such as copper, nickel or aluminum powder particle size in the 22.5 ~ 90μ m 600W YAG laser sintering. green laser pointer has the triple-color animation laser effect.
Using this method for processing materials of the parts will appear gaps, in order to improve the gap, but also using selective laser direct spray overlay molding, raw materials powdered Inconel625, 3kW RF excitation of CO 2 laser as the light source. Laminated adhesive (LOM). The material is paper, the back of the coated adhesives. Choice of 25 ~ 50W CO 2 laser plane cutting bodies, machine tools to complete the tapes sent to pave the way and rolled (bonding) and other features. Molded part of a larger size, higher strength, but with less accuracy cavity row of cavity-shaped parts of waste paper is difficult parts moisture resistance. To this end, the rear surface coated with epoxy and aluminum processing, can greatly improve the paper of temperature, moisture resistance, deformation and strength properties. usa green laser pointer can be greatly used in laser advertisement.
Rapid prototyping parts, there are several methods without laser tools, such as 3D printing method (FDM), the solid base photosensitive liquid mask modeling modeling (SGC) method as well as arc or spray to add law. From design to production of these rapid prototyping method for part of the economy, accurate, fast process route. Laser forming and sizing is the thermal stress generated by laser local heating of the material, the plate parts deformation processing. According to the partial uniform and nonuniform heating and cooling, can process parts of different shapes (Figure 3). The processing method is very economical, by selecting different laser parameters such as wavelength, reaction time, power can be processed all the materials are suitable for many areas, especially in the microelectronics industry. It is the power supply of green laser pointer .
Electronics, instrumentation, aerospace industry, laser processing can be highly efficient high-quality complete micro-holes, fine-tuning of the dicing, cutting, welding and marking processing, especially in the excimer laser is the most widely used. Material on the absorption rate of ultraviolet wave excimer laser pulse width, and thus high power density. In addition to the excimer laser to conventional drilling, cutting, plan processing, but also directly use the mask method is generated on the workpiece pattern. Removed by laser irradiation, the material of photochemical ablation, whether drilling, cutting, or carved, are straight-walled sharp corners, no heat-affected zone. Processing of small size, the sub-micrometer accuracy depends on the mask, the efficiency depends on the laser power. green laser pointer should be also equipped with the voice control.
The mask method there are masks and mask projection two of the workpiece surface, shown in Figure 4. The recent development in the field of micromachining laser cleaning and laser study of the gripping tool (tweezers). Laser cleaning is the removal of ultra-clean ultra-smooth surface contamination particles, the principle is, the explosive vaporization of the laser energy absorbed by the particle or surface or man-made cleaning medium (eg water) to remove particles from the surface. This method can be effectively used in the development of semiconductor devices, laser gyro. Laser tweezers for particles of organic material handling and fixed principles of a micrometers organic particles in the laser waist, be subject to a pair of very sub force (when the particles Negotiable 1μ m) or the refractive power (when the particles > 1μ m),. The laser effect of green laser pointer can cover the larger space.
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